Recent content by Victor Hugo Alvarez

Hey Josh I have an Xbox 360 Jasper motherboard with Short that dont start up Nothing, dont has any Light, I know Nothing about Eletrical Measurements SO i cant fix short But Do has You Interest in that Board??? Can you give me an working ps3 board in exchange to my xbox Jasper board???? Edit...

Indeed Heating the chips with Reflow/Reballing Degrades its eletrical physical health, so as I even heard Companys of telling Reflow or Reballing while building the mainboard can kill the Silicon then I should Say: WHEN YOU REBALLING THE CELL PROCESSOR ALWAYS FULLY COVER THE CELL DIE, CELL DIE...

Thats exactly what I said to Felix but nobody listen to What I Said, I just wrotte the Glue on Silicon is Titanium Solid so I dont think slight pressure or pressure could "fix" the bumps. Well at least @Pacorretaco listen to me.

Again I just want to apreciate you Felix, Thank you so much for your hard work on bringing the codes and all data and all job to make 40nm RSX swap possible on ps3 fats and slim, is Really Amazing and you super amazing!!! I cant wait to install one 40nm Rsx on my Fat ps3 Cok-002. I'm just...

I told Ya Felix, also Felix for what I know when I tryed to rip off that glue in lots of silicons I dyscover that thing is Titanium Solid so I think pretty much is nearly impossible to have variation of Pressure inside that bumps by just Moving and Puting a Little pressure in the board as the...

Great music, Funny song nane.

Yes Pacorretaco, that test of yours should be great to diagnos an Bump failure and my test should work too if we use líquid metal on die.

@RIP-Felix - "LACK OF PRESSURE IN THE RSX DIE AFTER REMOVING IHS WOULD MAKE WORK AGAIN, FIXING BUMPS BY DECOMPRESS" What Logic is that??????

@RIP-Felix Absolutely Not, Decom pressing the Bumps or Slight pressure while delidding would Not Make the Bumps Cracks to be fixed for a time as you said, thats is absolutely ridiculous, youre kind of BELIEVING in the BUMPS Failure Theory, Decompressing an Eletrical connection will nearly...

@RIP-Felix if you wanna absolutely Scientific tests then you shall know you don't use the words "break" or "burn out" when you trying to say that the bumps got Cracked.

I ALREADY TOLD HOW TO DETECT BUMP FAILURE IN AN RSX GPU, SO CAN ANY BODY PAY ATENTION OR AT LEAST LIKE MY COMMENT, JUST DO WHAT I SAID ABOUT PRESSURE ON RSX VRAMS, I DON'T HAVE ANY BOARD NOW WITH RSX BGA/BUMP ISSUE SO I CANT TEST IT.

Felix then you think slight or soft pressure can affect the Bumps!!? Alright that means that all pressure mods applied on processors should bring them back to life, so you have been refutated Felix cause no Puting an médium pressure will not bring processors back to life, you have to use alot of...

Felix You said The Nec Tokins only work at 67c on Coks, now do you believe 67c is enough to make that Burned Parts inside the Nec Tokins??? I dont think so!

Bro well i'm Not trying to disagree with your research but I really have to say as an real scientific analisys that Great Majority of People when they Remove the Nec Tokins they do Not Use Heat, they use physical force, and for what I see theres lots and lots and lots of ps3s that have Tokins...

Me? Naah, ohh hardly i find it an pure Logical argument, theres kind of 2 possibilities now, put pressure only across all Rsx fiberglass but not in the die and if work then will be proof that theres no bump failure detect in that SPECIFIC System Rsx, if the system wont work and if try a second...