Hello, I'm considering buying a CXD5302DGB for doing a frankenstein mod, it is the 40 nm version without IHS, but I've read on this forum that Rip-Felix said:
"The IHS from a 90nm will work fine. You'll need the added height to mate with the HS from the BC model. However, I have been told that the SS RSX is slighly thinner than the 40nm RSX from a slim. Meaning you may need a copper shim to get them to mate properly.The training will be possible and the rest of the process is the same. So that not an issue. You may just need to shim the processor to get it to make solid contact."
So I need to know what thickness must the copper shim be. Do I have to put it between the die and the IHS? Do I have to apply thermal paste between the shim and the IHS? Thanks in advance.
"The IHS from a 90nm will work fine. You'll need the added height to mate with the HS from the BC model. However, I have been told that the SS RSX is slighly thinner than the 40nm RSX from a slim. Meaning you may need a copper shim to get them to mate properly.The training will be possible and the rest of the process is the same. So that not an issue. You may just need to shim the processor to get it to make solid contact."
So I need to know what thickness must the copper shim be. Do I have to put it between the die and the IHS? Do I have to apply thermal paste between the shim and the IHS? Thanks in advance.