PS3 Frankenstein PHAT PS3: CECHA with 40nm RSX

@RIP-Felix

Not exactly, PS3 processors works at limit of temperature! Maybe youre just an very cold country and your temps wont reach enough to fan start its steps of speeds.

Here it's an Cech-20XX Reaching 86c on its Rsx 65nm and 73c Cell as its an 45nm one of Course Slim Ps3.

Its an Brazilian video But the guy is a very inter ps3 community and exploit, so he just made this made syscom vs Webman to people Who knows nothing about that tô learn, at 13 minutes and 24 secs he says the Max temps on syscom Mode.

 
Victor Hugo Alvarez said:
@RIP-Felix

Not exactly, PS3 processors works at limit of temperature!
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If that's always true (probably isn't) the CPU would be in the driver seat, causing the fans to ramp up, keeping the RSX temps lower than they would be if the RSX were in the driver seat.

You are over simplifying it a bit. There are lots of different heatsinks, and non-bc phat design changes. It's not as simple as saying the processor (which do you mean BTW?) is always operating at the limit of temperature.
 
Victor Hugo Alvarez said:
You Dont Get what I said, I was talking about an Observation or fact that Felix was Talking About, it was not about Cracked Bumps or Cracked Bgas But it was about Gpus that had its Bumps turn into Ashes due to bad Design in Eletrical Power Means, one Single Micro Bga/one single Bump would take too much power and then it would be destroyed by excessive Eletrical Current and Burn to Ashes.

And I said of Course PS3 Dont has that problem cause in absolut majority PS3 just come back to life after an Reflow, Detail I do Reflows on PS3 since I was 15 y.o at 2012.

You have to read Everything we said if you wanna argue.
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Postal is correct. If there were a bump failure, a reflow can, and likely would cause a thermomechanical reconnection that looked like the reflow fixed the BGA. Even if there was never an issue with the BGA.
 
RIP-Felix said:
Postal is correct. If there were a bump failure, a reflow can, and likely would cause a thermomechanical reconnection that looked like the reflow fixed the BGA. Even if there was never an issue with the BGA.
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No he is Not Correct, I was talking about the Bumps in some gpus that happen to be destroyed by overpowered Current and being burn by That, i'm saying that on based on your or Nvidia investigation on bumps that would fail by the overpowered voltage or current and then those individuals Bumps would be Turn into Ashes, i'm saying that based on your relatory or Nvidia Relatory that Some GPUS have that Problem and Again Using Logic Thinking which make Us Humans Scientists and Animals None, we can say absolutely PS3 never Had bump Destroyed by Eletrical Overpowered Bump Cause PS3 from Cok-001 to nearly all boards always come back to life after an reflow if the problem was Cracked soldering or Teoretically Cell - Rsx CRACKED BUMP Related.
 
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RIP-Felix said:
If that's always true (probably isn't) the CPU would be in the driver seat, causing the fans to ramp up, keeping the RSX temps lower than they would be if the RSX were in the driver seat.

You are over simplifying it a bit. There are lots of different heatsinks, and non-bc phat design changes. It's not as simple as saying the processor (which do you mean BTW?) is always operating at the limit of temperature.
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No Its Not like That, Don't you know that The PS3s Fats from K, H, L, P etc have their Cpu working at 81c just after 5 minutes turned on just in XMb? The Fan Won't care! Or Should I say, the person Who wrotte the Code for fan Steps based on Cell Cpu temps now change the fan Step to like: Cell Hits 81c and fan by syscom Eprom now sete fan to ~23%, its something Like that, also for PS3 Slims the Cell can Reach 80c and the fan Will not turn faster!! The only PS3S Who may "worry" about the Cell temps are the Original ones or the 4 usbs one, as you already know, I think you know, I think I heard you talking about, that those retrocompatible ones have fan sets that wont let Cell Reach 80c, so Yea as I already know that too, 4 usbs PS3s are the only to have a Fan set that will have its fan At 50% speed if Cell Reach 80c, but besides that in the normal ps3 Cok, its normal for Cell to Reach 77c and mostly if you Running ps2 emulating by software, and 77c will be fan Step 4, I count 74c fan 1, 75c fan 2, 76c fan 3, 77c fan 4, so Yes Even in the PS3 that May have its Cpu most cooled its still pretty close to limit as I already Tested and the Syscom turns PS3 off if Cell Reachs 90c and for RSX something about 95C.
 
@RIP-Felix video shows the bumps are affected by tempature voltage and wraping. hes not sayng that microsolderballs get destroyed completly from voltage. and even a lightly heat can recover the diy. for some time. (thermomechanical reconection)
 
Victor Hugo Alvarez said:
No he is Not Correct, I was talking about the Bumps in some gpus that happen to be destroyed by overpowered Current and being burn by That, i'm saying that on based on your or Nvidia investigation on bumps that would fail by the overpowered voltage or current and then those individuals Bumps would be Turn into Ashes, i'm saying that based on your relatory or Nvidia Relatory that Some GPUS have that Problem and Again Using Logic Thinking which make Us Humans Scientists and Animals None, we can say absolutely PS3 never Had bump Destroyed by Eletrical Overpowered Bump Cause PS3 from Cok-001 to nearly all boards always come back to life after an reflow if the problem was Cracked soldering or Teoretically Cell - Rsx CRACKED BUMP Related.
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That is an illistration. The voids and cracks from electromigration are microscipic and easily reconnected from slight changes in pressure.

I had an explosion effect and used it for visual purposes. It's not tlike they are burning to a crisp. Besides, even if some did there are many others that are on the verge of working and just haning on the edge of working. That's always the case, because the FlexIO can't maintail it's calibration if the bumps (or BGA for that matter) are marginal and constantly shifting impeedance during operation. When it gets just past the tippi g point, it begins failing. And then even miniscule changes in mounting pressure or temperature can cause it to work temporarily. Which can explain why people report being able to start the console after multiple attempts or heating it up first. Or a reflow, or completly unnecessary tokin replacment, or towel trick, or pressure test, or smacking the SOB upside the head a couple of times. The connection is precarious.
 
RIP-Felix said:
That is an illistration. The voids and cracks from electromigration are microscipic and easily reconnected from slight changes in pressure.

I had an explosion effect and used it for visual purposes. It's not tlike they are burning to a crisp. Besides, even if some did there are many others that are on the verge of working and just haning on the edge of working. That's always the case, because the FlexIO can't maintail it's calibration if the bumps (or BGA for that matter) are marginal and constantly shifting impeedance during operation. When it gets just past the tippi g point, it begins failing. And then even miniscule changes in mounting pressure or temperature can cause it to work temporarily. Which can explain why people report being able to start the console after multiple attempts or heating it up first. Or a reflow, or completly unnecessary tokin replacment, or towel trick, or pressure test, or smacking the SOB upside the head a couple of times. The connection is precarious.
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From What I know when Something is Destroyed by Much more Eletrical Power than what it can take that something that used to conduct that Energy will be absolutely destroyed by its eletrical power, it will burn at Such high Temps that will be Ashes after the excessive power unleashs in that Path.
 
RIP-Felix said:
That is an illistration. The voids and cracks from electromigration are microscipic and easily reconnected from slight changes in pressure.

I had an explosion effect and used it for visual purposes. It's not tlike they are burning to a crisp. Besides, even if some did there are many others that are on the verge of working and just haning on the edge of working. That's always the case, because the FlexIO can't maintail it's calibration if the bumps (or BGA for that matter) are marginal and constantly shifting impeedance during operation. When it gets just past the tippi g point, it begins failing. And then even miniscule changes in mounting pressure or temperature can cause it to work temporarily. Which can explain why people report being able to start the console after multiple attempts or heating it up first. Or a reflow, or completly unnecessary tokin replacment, or towel trick, or pressure test, or smacking the SOB upside the head a couple of times. The connection is precarious.
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Would you mind posting the video link please?
 
Dariush Aghaee said:
But can we consider better design of cell on the same transistor size?
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Better design of Cell? Well maybe in the Cells with Black Plastic between the IHS and its Body of Fiberglass, that one would Have better Copper wire inside of its fiberglass but only that, cause its thickness its ultra thin like half the or less the thickness of standart Cell fiberglass, but for that Cell only find in just some of the ps3 Ss I believe that one was obvious as seens it was made smaller fiberglass to cut production Prices on ps3.
 
RIP-Felix said:
Progress on that is stalled. There isn't any point. The 90nm Cell is not a major concern in terms of reliability. The RSX was. So now that it's replaceable, the console should be good to go (even with stock fan curve).
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So here its final test of proof, of Rsx Bumps, Remove Rsx Ihs and replace rsx ihs back but turn it inside out, the name Rsx must be turned inside and by That the pressure will only be based on the 4 Vrams and the Vrams will send the pressure to Rsx Substrate! Also if better you could put any kind of material that is safe of Course like Cardboard all across the Green área of the Rsx Fiberglass but Not in the Silicon just in the área around the Silicon, then you put some thermal paste, but as the Vrams are taller than the gpu core then the gpu will overheat after some seconds but if is an 4 usbs we shall see the console being turned on at least for 5 seconds and then overheat, but well i just forget to say the most important thing is you must put like an very very thick like 3 mm material like an Ihs in the área were the gpu clamps sits, Okay ALRIGHT, IF the console works that will Absolutely be proof that its the Big Bgas the Main Problem and Not the bumps cause the pressure is about 0.0 on Rsx Die, And I Will go ahead and say I did that already and my Cok-001 Worked Fine, but then I place some very very thin metal board on Rsx Die to have Rsx Die be cooled and the gpu to not be overheated.
 
Wanna even better more absolut proof, put the Rsx Ihs back in place but with the name Rsx for the side of gpu Die, just inside out, but use líquid metal, that will leave some big gap between Rsx Die and ihs, then put some very thick metal between clamps of Rsx, if you have some ihs will be great, now screw it with care but with Pressure and the console shall work again, being final evidence that the bumps in the 90nm are not the main reason of ylod and indeed it its the big bgas.
 
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