Isn't Epoxy a complete mess-up in terms of a possible re-visit, if the new owner decides to re-apply some new paste at some point in the future?
Wouldn't do some basic thermal paste like MX2 instead of epoxy on the RSX-Ram chips do almost the same?
Maybe it drys out quick, fill the gap and may prevent the RSX-PCB from warping too?
I dont like to use the term epoxy neither resine for this case, because for me this kinf of "bi-component" products involves a very strong bounding (the result of most of this products is a material as strong as the rock)
...but the fact is there are some bi-component adhesives that i guess are based in epoxy/resine and the density of the material is a bit flexible... the problem when seleting this kind of products is we need to know very well the specifications of the exact product and the exact brand we are talkig about
I guess the reason why some of them are a bit flesible is because only contains a very small percentage of epoxy resine... lets say 10% (and the other 90% is silicone or whatever)... so it depends a lot of the chemical formula used by the manufacturer
The problem is we should not tell a newcomer simply to use a generic resine/epoxy because if he asks about it in a general store they are going to give them something super hard and the result is going to be a disaster (you are not able to unsitck it ever)
Time ago i bought a product from arctic cooling (i dont remember the name sorry) that was a bi-component in white color (and was smeeling like jummy strawberry) where the resulting material had the density of a blubblegum (a bit harder but clos, it was like rubber, you could press a bit of it with your fingers and it was returning back to his original volume)
It was like a paste to make your own thermal pads
Thats the main goal we need to achieve, because there is a tiny gap in between the RSX RAM chips and the RSX IHS... we cant use standard thermal paste in them because we know along time (when it gets dry) is going to reduce his volume, eventually will lost all humidity and will become dust... and eventually couold fall apart from the RAM chip
The kind of thermal adhesive i mentioned with the density of a bubblegum is perfect for that purpose, because is like a piece of rubber
RIP-Felix was going one step further because he want to improve the mechanical resistance by using something harder (less flexible than the bubblegum i mentioned)
In that case yeah.. you need to be really picky in selecting the exact brand/product suggested by others because you are trying to adjust that density very accuratelly
Otherway... i really think there are lot of silicones intended for industrial use that are going to do the work well and are cheap, the grey silicone used to seal car/bikes engines is fine, his density is good enought to fill the RAM gaps, is not going to decrease in volume, and is designed to handle high temperatures
Additionally... the RSX RAM chips doesnt seems to overheat by themselfs and can handle high temperatures, they could fail because the microbumps under them but i dont think the internal circuitry is going to be fryed
So all this considerations about the thermal compound used in the RSX RAM chips are not much important imo