Lmao LMAO The 40nm GPUs ARE ALREADY 12 years Old From Slims and 10 years old from SS, So theres No way you can say to your customer that he Will have an safe gpu with long life, Also you must remenber that the way to prevent ps3 problems in general is to use Webman an tool that take great knowledge from Psx Place proggamers.
Yes, it used to be the norm. But now that there's a better way available, why stick to the old way? That is what I'm also trying to understand. Bumpgate or Bga, the 40nm processor is cooler and more reliable. Of course, reasonably anybody would prefer that over taking the risk of reballing prone-to-issues 90nm and hoping it holds up ?
But if you also have rates for the consoles you reballed, then do share. But even with statistics we wouldn't know 100% if all the consoles that didn't come back in fact stayed alive and for how long. How would you know if the customer didn't simply gave up/ used it for a short time and moved on? Or perhaps you have tracked the reballed consoles (specifically 90nm ones) that still work and don't have issues?
If you are aiming at scientific proof, then sure. Maybe that's how it could be/should be done. But yet those chips were documented to have issues. And it's not only big bgas. And they did develop problems more often than any other chips at the time.
Oh I would say his chances of having a console YLODing from a 3034 fault are way lower with a 40nm on board rather than with the 90nm. So you rate reliability based on how old a processor Is ? With that logic a 16 year old Cell is no way safe either. That's got nothing to do with how old they are though. You do realize some systems had very little use from 20 to 50 days, while others could have logged 300 days. If anything, I'd look at that more than age of the proccesors. Not to mention 40nm NOS chips can be found brand new on ebay. But also 3034 error could develop at any time regardless of the age. Some GPUs are tougher than others.
And what's that got to do with anything? You don't believe in evolution?
No Mr.Deadend I dont disagree with you about 40nm being more durable cause its newer, I was just Following your thought, well the 40nm are 10 years old and well they not brand new, anyways, I would fully Love to put an 40nm Rsx on Cok-00xs and Fats in general, May only problem is the 90nm is not trash cause nobody prove it has total Failure due to Teoretically Broken/Cracked Bumps.
DON'T READ IF YOU LOOKING FOR PS3-COMPUTER TOPIC- HERE IS JUST MY WORLD VIEW;
Well I think pretty much in this place or topic is not the place to argue into a brand new Diferent area of science which has nothing to do with our topic, actually I just wanted people to know my Position in world view and my logical view by science philosophy of how we as biological creatures came to be, my scientific view of the world, my theory, my logic, my absolutely logical world view is we came from an Inteligent mind that designed us, for me absolutely, Random Mutations Could Never Create not Even one Single bacteria Cell but Random mutation indeed bring cancer to people/líving biomolecular creatures, i'm Not arguing I just said my absolut philosophy, i'll not argue here about that with nobody cause im sure the moderators will not accept that here cause its no place for that topic or Psx Place.
Edit:
@Pacorretaco thanks for support
Edit 2: also for me, my view, is that the 40nm Rsx on Coks heatsink will mostly likely only Fall with 100 years or something, Idk how long will live but I believe that due to extremely low temperatures that chip will never die by Bga cracks, I believe only Temps of 80c cracks the bgas, and like I said before my theoretilly (by Now) mod is to mod ps3 Coks heatsink Cpu and Gpu together only for the Franks cause as the 40nm works so cold as ~58c we can make the Cell Heatsink together with Rsx Part and for that making Cell High Temps of 75c factory to decrease Teoretically 10c or more and Rsx working at 68c Max will be no problem, it will be perfect to prevent Such high Temps on Cell!!
Edit 3: An Professional It Repair in Brasil: (Getech Informatica) the owner does some reballing some times, cause he is the Boss só he dont need to do Repairs cause he has employers, but anyways he does Reballing some times and when he rarely dont has vídeo in an Gpu like an Vega 64 he says: "well I just reballed this gpu perfectly but its not working/showing picture/vídeo Sooo it can only be the Bumps (Micro internal under gpu die bgas) and thats it only a New gpu could make it work"
So he all the time he makes one reballing and the graphics card shows no video/Not Working Gpu, then he says its the Bumps, which logically is Not Correctly as the Internal Micro Bgas or Bumps have Been reflowed During the Reballing, AND right now comes in my mind that Felix said only 350c could actually Melt the internal Bgas could they have diferent alloy and NOW logically I could say when we Reflow an processor and Everybody or the Reballing is Bullshit "says when you doyng and reflow or reballing youre actually just reflowing the bumps and making the chip work again, but again Felix said some bumps could only be melted at 350c and I cant remenber what bumps he was talking about, Idk if was general bumps or specific But fact is again If you Reball or Reflow an Chip which you Will use Max 245c Max and you Will never be able to reflow the bumps cause they melt at 350c Acording tô Felix, so its all an mess of Information, which one is right???? The higher melting point Bumps of 350c as Felix Said sounds to make my believe of Bumps hardly being Cracked more close to the truth, as Intel Processors or Amd Processors Rarely Rarely Rarely rarely Fails and they do Use Bumps but Not Bgas and when they do Use Bgas like an NoteBook then there they Start to Fail which again proves its not Bumps and yes its the Bga Cracking the problem.
As I said before extremely thin Soldering like the ones that are always left on pads are always conductivy and show no deffect, so as I said before as the Bumps are Extremely small as the rest of solder in an cleaned pad in thickness wise I say or the solder is so extremely thin in thickness that the electrical Waves has no problem going trhough that ultra extreme small cracks or the bumps dont crack at all.
