MalwarePup
Member
Hi,
I'm currently training my BGA skills using an CECHG unit. The original 90nm RSX caused a YLOD, so I decided to remove it as part of my training. Since this console isn't expensive and is mainly for practice, I didn't worry too much about potential damage during the process.
The RSX came off without much effort, but after removal and cleaning the board, I noticed that one of the pads has been removed. I'm not sure if it happened during the removal or during the cleaning process afterward.
I'm wondering if it's still possible to solder a 65nm or 40nm RSX back onto the board for training purposes, even with this missing pad.
Thanks in advance for any advice!
I'm currently training my BGA skills using an CECHG unit. The original 90nm RSX caused a YLOD, so I decided to remove it as part of my training. Since this console isn't expensive and is mainly for practice, I didn't worry too much about potential damage during the process.
The RSX came off without much effort, but after removal and cleaning the board, I noticed that one of the pads has been removed. I'm not sure if it happened during the removal or during the cleaning process afterward.
I'm wondering if it's still possible to solder a 65nm or 40nm RSX back onto the board for training purposes, even with this missing pad.
Thanks in advance for any advice!
