PS3 CECHH temps after repaste with MX-4

L

locarno

Member
Are those temps ok for FAT CECHH that is freshly repasted with MX-4? I think CPU temp is too high. I spreaed thin layer of paste on whole chip surface. I don't know but I think it is worse than before repaste.

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in my opinion you have to delid your cpu man...your thermal paste behind the big metal surface that covers the cpu die is dried. you can try to look these type of videos.


but you have to be careful, you can break the cpu of at little lines of it via a little scratch
 
Heatsink delid is the last thing you want to do.
Is the heatsink torqued correctly, missed a screw to torque fully? Remove heatsink and make photos of thermal paste after lifting heatsink to see how it contacts IHS and Heatsink.
 
mimi said:
Heatsink delid is the last thing you want to do.
Is the heatsink torqued correctly, missed a screw to torque fully? Remove heatsink and make photos of thermal paste after lifting heatsink to see how it contacts IHS and Heatsink.
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CECHH has a 65nm CELL and 90nm RSX, the RSX should be considerably hotter than the cell yet the cell has a 20 degree lead over the rsx. Its classic bad thermal paste under the ihs IMO, assuming the console never had its heatsinks unscrewed beforehand.

CECHH is kind of a junk console anyways, might be good practice if its not their only console. DIA boards are pretty sturdy and easy to get to. The thermal pad trick is also an option, not a good one but it's one I've been using on my CECHK for the past 2 years with no problems, I check for warping every 6 or so months when I clean it out and have found no warping on the board. As long as you're conservative with the pad size and dont use something stupid like an eraser or coins I do believe its a somewhat safe practice for DIA boards, maybe. I only have 1 sample
 
Ganjo said:
The CELL 100% needs a delid. Dont put pads or anything else under the chips, ever.
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It's an option that's had success for a lot of people, there is a solid risk of a newbie scuffing up their CELL's substrate and bricking the entire console compared to the smaller risk of cracking the CELL or warping the board. 3d printing a CELL bracer is also a good idea but wont reduce temps all that much

It'll die from the 90nm RSX long before a sensibly done thermal pad trick IMO, board should be swapped for a DIA-2 anyways
 
vithor_VIL said:
After the delid, how you guys glue back together the metal case ? Or don't glue them at all ?
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There's no need to glue it back if you don't want to. You can just put it back in place, the thermal paste and clamps will hold the IHS. Just make sure it doesn't shift when you install the metal shields, and try to tighten the clamps alternately to spread the paste evenly.
 
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