PS3 Informations about cecha06

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Nate8893

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Hi , im considering buying a full bc ps3 cecha06 but im pretty nervous about it because of the caps. The console is listed for 200 bucks and has never been opened but idk if it has a lot of hours put on. I plan to deep clean it repaste (not the dies at least yet since i dont have tools and experience with) and put cfw on to control the fan. Since it is made in china does it have the 15 or 19 blades fan ? And does it have the aps 226 psu instead of the zss ?
Sorry i do ask a lot maybe xd but im new to fat ps3s unlike slims witch im used too. I do apologize if there is a similar topic but i dident find anything to awnser my questions. Thank yall :)
 
So I own a CECHA & CECHB systems. They won't have the APS as that came in the later 40gb model.

https://www.psx-place.com/threads/my-cechb-01-teensy-stealth.9534/

As you can see here I am running temps close to slim systems. The system is still running strong but I have also replaced the NEC Tokin caps which is what tends to fail.

https://www.psx-place.com/threads/research-experimental-nec-tokin-capacitors-replacement-ylod.25260/

That being said I have since gotten a CECHA model and I haven't done any upgrades aside from the NEC Tokin caps. Haven't done the PSU or the fan upgrade yet but runs amazing still. I would make it priority to do the NEC caps and you will be fine. I do not suggest delidding unless it is the very last thing to try. It can kill the system if not done right and is rarely needed to get them running tip top. The BC systems can reliable you just have to keep up with maintenance.

https://www.psx-place.com/threads/total-uptime-of-my-new-system.35793/

As long as you can get the needed maintenance done they are rock solid. Actually my next endeavor will be getting someone to do the small 40nm RSX mod to really keep the temps down.
 
I see , yeah the caps process is well explained and your ps3 runs hella cool even cooler than my 2504
Im less "stressed" about getting a bc ps3 but i saw there could be a way to add tendulm cap(s) in parrallel of the nes how does that works ? To be honest i would at least practice on 2 or 3 dead ps3 before doing it on the working one
 
Nate8893 said:
I see , yeah the caps process is well explained and your ps3 runs hella cool even cooler than my 2504
Im less "stressed" about getting a bc ps3 but i saw there could be a way to add tendulm cap(s) in parrallel of the nes how does that works ? To be honest i would at least practice on 2 or 3 dead ps3 before doing it on the working one
Click to expand...


Well I do not do my own work man being 100% honest. I have a buddy that does my work for me. He is the R&D guy for the GC, N64, Xbox, PS1, Dreamcast. He has done more but I have trusted him for years. Never let me down but I do know he doesn't do install work anymore aside from a friend time to time.
 
If the console runs and fan is not loud, you do not do need to do anything but enjouy it.

Most phat PS3's do need new CPU paste under the IHS. And CPU BGA defects do happen. You need to make a proper tool to safely delid. And you should glue the IHS back on afterwards to stiffen the interposer. It reduces warping stress that will wear out the solder balls.

The NEC/TOKINs do NOT "tend" to be what fails. The can go bad, but it is much more likly to suffer a BGA/Bump defect. Unless properly diagnosed with bad tokins, don't replace them! You are likly to stress the BGA and make matters worse, unless you know what you're doing and are very careful.
 
RIP-Felix said:
If the console runs and fan is not loud, you do not do need to do anything but enjouy it.

Most phat PS3's do need new CPU paste under the IHS. And CPU BGA defects do happen. You need to make a proper tool to safely delid. And you should glue the IHS back on afterwards to stiffen the interposer. It reduces warping stress that will wear out the solder balls.

The NEC/TOKINs do NOT "tend" to be what fails. The can go bad, but it is much more likly to suffer a BGA/Bump defect. Unless properly diagnosed with bad tokins, don't replace them! You are likly to stress the BGA and make matters worse, unless you know what you're doing and are very careful.
Click to expand...
okay thats reassuring to hear i do plan to enjoy and keep it real clean for the ihs repaste on the cpu i will do when i will be confident about and have the tools and once it will be hot ( 70-72 is too much so it will be my limit) but im glad to hear that the nec may be not always the issue because there are a lot of misinformation about that and well the bga i will keep em in mind but i wouldent have to reball the cpu
 
Nate8893 said:
okay thats reassuring to hear i do plan to enjoy and keep it real clean for the ihs repaste on the cpu i will do when i will be confident about and have the tools and once it will be hot ( 70-72 is too much so it will be my limit) but im glad to hear that the nec may be not always the issue because there are a lot of misinformation about that and well the bga i will keep em in mind but i wouldn't have to reball the cpu
Click to expand...

If you ever need to delid the CPU IHS, it's easy to do once you make the proper tool. Just be sure to glue it down. Most people think the CPU is more difficult to delid than the GPU (RSX), but with that tool it's a breeze. I don't recommend delidding the RSX unless temps are out of control. The RSX is more difficult and risky. But if you do, use a high quality thermal paste on the die and use thermal adhesive on the VRAM like it had before. That stiffens the package, making it last longer before a BGA/Bump defect forces a reball or replacment GPU (inevitable for 90nm RSX I'm afraid).
 
RIP-Felix said:
If you ever need to delid the CPU IHS, it's easy to do once you make the proper tool. Just be sure to glue it down. Most people think the CPU is more difficult to delid than the GPU (RSX), but with that tool it's a breeze. I don't recommend delidding the RSX unless temps are out of control. The RSX is more difficult and risky. But if you do, use a high quality thermal paste on the die and use thermal adhesive on the VRAM like it had before. That stiffens the package, making it last longer before a BGA/Bump defect forces a reball or replacment GPU (inevitable for 90nm RSX I'm afraid).
Click to expand...
I will keep that in mind thx guys and im glad to announce the console has been well taken care of. Thr first owner used it only for listenig to music and the guy from who i bought used like 2 times in 5 years , that not even a joke but yeah will apply and listen all your feedbacks :)
 
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