My question to those with more knowledge: Does the heat from reballing (when swapping GPUs for a Frankenstein) really impact the overclockability of the chip?
Say we took the 40nm out of a 2500 that we know can reach 950/1000 before removing it and solder it onto a CECHA, should we really be expecting the achievable clock speed to be lower (e.g. max of 800/950) due to the heat from the process of removing and soldering back onto its new board? It sounds reasonable at first, but then again, weren't these chips soldered on from the factory at the same or even higher temperatures (due to lead-free solder being used)? If the achievable clock speed is lower, are there not other factors that may be the cause (say the VRMs on the CECHA not being as good, or maybe the old TOKINs not giving the best smoothing performance?
The reason I ask this is, while we can't use the 28nm RSXs for a Frankenstein (yet, maybe one day), surely we can use the
latest 40nm from the early 4000 super slims before the 28nm changeover, and in theory they should be even more capable of higher clocks than even the best 2500s, and even a step above in quality than the 2500s Slims with minver of 3.60 and above like the 3000s. This is of course assuming that they aren't negatively affected by the heat involved in plundering them off their super slim motherboards and soldering them onto CECHA boards, which is what my question at the top of this post is asking about.
The
CXD5302DGB or
CXD5302A1GB are the 40nm's I'm referring to from the MSX-001 and MPX-001 40xx respectively, 42xx and 43xx were the 4000s with 28nm RSXs.