PS3 PS3 Phat Temperature advice

Reda Otrosh

Forum Noob
Hello guys,

It is my first post here.

I bought a used PS3 Phat 80GB, after jailbreak it by HEN 4.87 I start to get warning about temperature exceed 84 C for Cell while RSX around 50~60C, I have used fan control by webman with auto <68C, the FAN kicked to 50% most of the times, what I did.
1.User office eraser underneath the Cell (temp reduced with syscon config from 85 to 80 at idle)
2. apply new thermal paste for RSX and Cell after cleaning without the eraser underneath Cell(Cell temp get around 69 to 71 and RSX 50, syscon config)
3. with the new thermal paste and office eraser i get (Cell 59 and RSX 55 with fan control <68 and fan speed always 31% at idle and ingming fan around 33%)
is that optimal or I need to delid the Cell or anything else
Please advice
 
Hello guys,

It is my first post here.

I bought a used PS3 Phat 80GB, after jailbreak it by HEN 4.87 I start to get warning about temperature exceed 84 C for Cell while RSX around 50~60C, I have used fan control by webman with auto <68C, the FAN kicked to 50% most of the times, what I did.
1.User office eraser underneath the Cell (temp reduced with syscon config from 85 to 80 at idle)
2. apply new thermal paste for RSX and Cell after cleaning without the eraser underneath Cell(Cell temp get around 69 to 71 and RSX 50, syscon config)
3. with the new thermal paste and office eraser i get (Cell 59 and RSX 55 with fan control <68 and fan speed always 31% at idle and ingming fan around 33%)
is that optimal or I need to delid the Cell or anything else
Please advice

All depends on the phat model, the older versions have a 90nm size CELL and RSX, they are getting on a bit so generate more heat.
Models that have 65nm sizes tend to far better in the heat department.

After much experimentation with heat transfer and fan settings, the following is advisable:

1.Delid both CELL and RSX if you can - your rubber trick seems to work ok
2.Make sure the heat transfer rating of the thermal compound is good >8 (Artic MX4) (https://www.wepc.com/reviews/best-thermal-paste/)
3.Add thermal padding to the NEC tokins, IC buck chips etc and the CELL and RSX top shield pressure points, only needs less than 1mm in depth - keeps the heat transferred to the metal chassis which can absorb most of the heat.

If you follow the syscon fault finding thread, you set the default syscon factory fan settings to a good level, otherwise stick to the webman fan control.

As a base values on a CECHG03 model - CELL and RSX are 90nm in size, on idle after 8 mins the following is read:

CELL = 69C, RSX = 68C or lower, Fan speed is at 28% (tweaked syscon factory settings from starting value) - Default factory syscon fan settings allow heat to grow at 76C before kicking up from fan speed of 20% to 22%, 25%.

When the fan is in good condition it wont create much noise, but a fan in poor condition (dry bearings) will be noisy even at a low level.

With tweaked syscon fan settings, even on hard hitting games, the fan speed never goes above 35%, mainly because the build up heat doesn't exist thus cooling down is at a faster rate at the expense of more power usage and higher idle fan speed.
 
A general advice, since your PS3 is a fat model, I'd just install CFW instead of HEN.
That way, you can have webman mod fan-control always activated right from the boot up.

I noticed that webman need HEN started always but it is ok with me, always I start HEN after any boot.


All depends on the phat model, the older versions have a 90nm size CELL and RSX, they are getting on a bit so generate more heat.
Models that have 65nm sizes tend to far better in the heat department.

After much experimentation with heat transfer and fan settings, the following is advisable:

1.Delid both CELL and RSX if you can - your rubber trick seems to work ok
2.Make sure the heat transfer rating of the thermal compound is good >8 (Artic MX4) (https://www.wepc.com/reviews/best-thermal-paste/)
3.Add thermal padding to the NEC tokins, IC buck chips etc and the CELL and RSX top shield pressure points, only needs less than 1mm in depth - keeps the heat transferred to the metal chassis which can absorb most of the heat.

If you follow the syscon fault finding thread, you set the default syscon factory fan settings to a good level, otherwise stick to the webman fan control.

As a base values on a CECHG03 model - CELL and RSX are 90nm in size, on idle after 8 mins the following is read:

CELL = 69C, RSX = 68C or lower, Fan speed is at 28% (tweaked syscon factory settings from starting value) - Default factory syscon fan settings allow heat to grow at 76C before kicking up from fan speed of 20% to 22%, 25%.

When the fan is in good condition it wont create much noise, but a fan in poor condition (dry bearings) will be noisy even at a low level.

With tweaked syscon fan settings, even on hard hitting games, the fan speed never goes above 35%, mainly because the build up heat doesn't exist thus cooling down is at a faster rate at the expense of more power usage and higher idle fan speed.

My ps3 had 65nm cell and rsx. I am afraid to delid as I see many users brick it many times and there is no one pro in my town.
As you said rubber is ok.
Fans even at 80% is not loud too much and my ps3 only 84 days startup time(as webman).
Now temperature level RSX 54 AND CELL 59 and FAN 30%, if I play GT6 RSX 58 and CELL 63 Fan 33%.
Are these values ok?
 
Hello guys,

It is my first post here.

I bought a used PS3 Phat 80GB, after jailbreak it by HEN 4.87 I start to get warning about temperature exceed 84 C for Cell while RSX around 50~60C, I have used fan control by webman with auto <68C, the FAN kicked to 50% most of the times, what I did.
1.User office eraser underneath the Cell (temp reduced with syscon config from 85 to 80 at idle)
2. apply new thermal paste for RSX and Cell after cleaning without the eraser underneath Cell(Cell temp get around 69 to 71 and RSX 50, syscon config)
3. with the new thermal paste and office eraser i get (Cell 59 and RSX 55 with fan control <68 and fan speed always 31% at idle and ingming fan around 33%)
is that optimal or I need to delid the Cell or anything else
Please advice

First question is why did you install HEN? I highly recommend you install a cobra CFW like Evilnat or Ferrox. But regardless, those temps are ok. I usually keep my fan at 40%. Temps don't ever go past 68°c.
 
It is my first post here.

I bought a used PS3 Phat 80GB, after jailbreak it by HEN 4.87 I start to get warning about temperature exceed 84 C for Cell while RSX around 50~60C, I have used fan control by webman with auto <68C, the FAN kicked to 50% most of the times, what I did.
1.User office eraser underneath the Cell (temp reduced with syscon config from 85 to 80 at idle)
2. apply new thermal paste for RSX and Cell after cleaning without the eraser underneath Cell(Cell temp get around 69 to 71 and RSX 50, syscon config)
3. with the new thermal paste and office eraser i get (Cell 59 and RSX 55 with fan control <68 and fan speed always 31% at idle and ingming fan around 33%)
is that optimal or I need to delid the Cell or anything else


The eraser mod has worked for you but at some point you're going to hit the wall. Like Bucanero said, I would install a CFW and WebmanMod so that the fan starts up right at boot time. I have 4.84.2 REX installed with my fan set to 60% all the time. At first it was loud but now I'm used to it. My current temps are CPU 46C and RSX 44C. It's cold here and I have one of the windows open for fresh air :quartet: In summer, my temps get almost to 60C but have never gone over.
If my temps ever get over 65C for regular use I'll look into doing a delid. My place of employment has all the tools and jigs for pc boards so I'm lucky in that regard. I'll still buy a broken PS3 to practice on before attempting on my system. One scratch in the wrong place and your console will be a paper weight.
 
Keeping Temps below 50c is an overkill and needlessly straining fan at 60% speed. PS3 can easily handle up to 70c Temps. Beyond 70c is a cause for concern and requires some solution to overheating. Of course Delid is the best solution but its easier said than done. Countless motherboards have been destroyed attempting Delid. Its the last resort if you can't keep temps down by using high custom fan speed, reapplying thermal paste on top of IHS and using eraser method.
 
50c? way too cool and noisy. I have my 360 at 60c and the ps3 at 68c. the ps3's cell can endure heat better than the 360, and both run very cool for me regardless. not 50c except for maybe the 360's cpu. it runs about 125F on idle at all times.
 
Don't delid if your temperatures are under control (under 68° C) with new thermal compound.


Delid is very dangerous. It's the last resort.

Only dangerous if you use a hammer and chizle!

Honestly, its not that hard or dangerous, just need the correct tools and patience.

Might do a youtube video on this as people seem to be too scared to do it.
 
Only dangerous if you use a hammer and chizle!

Honestly, its not that hard or dangerous, just need the correct tools and patience.

Might do a youtube video on this as people seem to be too scared to do it.
Of course it's dangerous. A lot of people killed their PS3. Just check a lot of threads with people looking for some help after unsuccessful delids. If the temperatures are ok, there is no need to do it.

Some threads with unsuccessful delid:
https://www.psx-place.com/threads/cech2501a-delid-gone-bad.29324/

https://www.psx-place.com/threads/ps3-slim-blackout-delid-glod-lesson-learned.28197/

https://www.psx-place.com/threads/y...nput-from-the-community-on-next-action.31485/
 
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Only dangerous if you use a hammer and chizle!

Honestly, its not that hard or dangerous, just need the correct tools and patience.

Might do a youtube video on this as people seem to be too scared to do it.

I used .3 mm modified feeler spatula and painting knives which are considered safe tools. Still i was unlucky and scratched the substrate.

There are tons of videos out there on delidding. NSC modz has good understanding on this and even he says that its highly risky job on PS3.

Many users have destroyed their PS3 because of WRONG advice on delidding. Delidding is the last resort to solve overheating, not the first resort.

By the way thread on delidding already out there for users who actually need it after exploiting all other alternatives to solve overheating.

https://www.psx-place.com/threads/d...-of-different-ideas-easy-safe-and-fast.31520/
 
Of course it's dangerous. A lot of people killed their PS3. Just check a lot of threads with people looking for some help after unsuccessful delids. If the temperatures are ok, there is no need to do it.

Some threads with unsuccessful delid:
https://www.psx-place.com/threads/cech2501a-delid-gone-bad.29324/

https://www.psx-place.com/threads/ps3-slim-blackout-delid-glod-lesson-learned.28197/

https://www.psx-place.com/threads/y...nput-from-the-community-on-next-action.31485/

These threads don't explain how they did the procedure and what tools they used.

I agree if the temps are ok then no need to do it, but my philosophy in life, is 'If you don't try yourself, you will never know'.

Many users have destroyed their PS3 because of WRONG advice on delidding. Delidding is the last resort to solve overheating, not the first resort.

It is a shame people are following the incorrect advise, but delidding is inevitable! Like a car without oil, will eventually seize up.
 
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These threads don't explain how they did the procedure and what tools they used.

I agree if the temps are ok then no need to do it, but my philosophy in life, is 'If you don't try yourself, you will never know'.
I already delided mine PS3, and it was not easy as you said. Those threads are just an example, there is a few more.
 
I will not try to delid even I am computer engineer and in my work I have all the tools, but as you said it is the last resort, and now with the eraser and new thermal paste during gaming GT6 or anything else(FAN 33% CELL around 60~61 C and RSX 50 to 55C) so it is ok now.
Even some tests with syscon during gaming the temps didnt exceed 71 for CELL.
thank you guys.
 
I have used thermal paste with the below specs Silicon paste,

Specifications: - Thermal Conductivity: > 1.19W/m-k - Thermal Resistance: <0.260°C-in2 /W - Color: White - Dimensions: 15.5cmx2.1cm
Which is the best specs to use, since I found many to use metal paste with thermal conductivity:> 12w/m-k and my work we have HP thermal paste original but I dont have there specs, so is the one that I have used is fine and what is the difference can I get If I use higher thermal conductivity compound. since the higher one price as the same as I get the PS3.
 
Keeping Temps below 50c is an overkill and needlessly straining fan at 60% speed. PS3 can easily handle up to 70c Temps. Beyond 70c is a cause for concern and requires some solution to overheating. Of course Delid is the best solution but its easier said than done. Countless motherboards have been destroyed attempting Delid. Its the last resort if you can't keep temps down by using high custom fan speed, reapplying thermal paste on top of IHS and using eraser method.
the cooler the better. I want my system to last until they throw me in the box. I've got plenty of replacement fans and after running the fan at 60% for a couple of years it doesn't bother me anymore. The only way I get my cpu and rsx to mid 40s is when the window is open and it's 0 or colder outside. Last week it was -10 and with the window open the PS3 temps dropped to the mid 40s. :cold: Once the window is closed it goes back to mid 50s.
 

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