PS3 PS3 Slim CPU overheating..RSX fine

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free1616

Member
Dear PSX Place Community,
I have completely cleaned my PS3 Slim, replaced thermal paste etc.
Unfortunately, nothing has changed in the CPU temperature.
Even while playing or after, the temperature of the CPU is 74-75°C, RSX is okay.

Before cleaning idle temperatures:
CPU 74°C
RSX 65°C

After cleaning idle temperatures:
CPU 74°C
RSX 54-55°C

ps. Some time ago I ran PS3 Unlock HDD Space by picard (aka 3141card).

Can that be the reason?


I need some advice on this :)
 
PS3 is set to maintain CPU temp at about 74C so it does, even if you change to liquid metal, delid, etc. You should have noticed a quieter fan. But i don't know stock temp. target for CPU.
CPU always runs hotter than GPU.

And its not overheating.
 
Which Slim do you have? 20xx, 21xx, 25xx, 30xx. A delid might help, but I think it depends on the model because can be tricky to remove IHS on certain Slim models.
 
free1616 said:
I have the 2504 mod.
Click to expand...
Then unfortunately you are in the trickier situation. I believe the 25xx slims have the IHS glued to the die. Which is a lot more difficult than a normal delid. I recommend doing some research on it, in fact it may be even worth selling on your 25xx slim and buying a replacement if you think the risk is too high / too difficult of a delid.

The other option would be to use more aggressive fan cooling, are you using Cobra/webMAN fan control? I personally keep my temps dynamic at 61c and it works a treat on my 25xx slim. The highest it peaked was 70% on God of War 2 (from GOW Collection) during the Kraken fight but other than that under peak load doesn't usually go beyond 50%.
 
You could try the "eraser mod". Put a small piece of a eraser under the CELL (in that place with golden little squares). Preferably use a hard eraser (high density). A image showing the bottom of a CECH-25XXX motherboard:

(https://www.psdevwiki.com/ps3/images/f/fc/JTP-001_(bottom_view).jpg)

The intention would be to increase the pressure and consequently the heat dissipation due to the greater contact between the CELL IHS and the heatsink.
 
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