CECH2501A delid gone... bad

[Hawk8789]

I'm curious to hear input from you guys on my recent experience. I had a 2501 someone gave me years ago that I reapplied the thermal paste on immediately. I hadn't used it in a while until just recently and it shut off while I was in the ps store. I thought it was too hot so I put hen on it to check temps. Rsx and cell were in the low 70s at idle.

I delid the rsx, and made a gentle attempt on the cell. I didn't want to ruin my 100% delid success rate so I gave up at the first sign of resistance.

With new paste and only the rsx delid, both chips stay put @ 62 while gaming at 35% fan. I think from now on I will only delid the cell as a last resort.

I didn't think the heat sink was capable of having one chip heat the other so much.

 

[finalman]

Do we know if any of the JSD-001 or JTP-001 motherboards from CECH-25xx PS3's without the black plastic spacer on the Cell have glued IHS's?

UPDATE: The two I delidded were not glued.

 

[roack9]

wow i better not delid the cell on my cech-2504b then. maybe the rsx if its temps bothers me.

 

[Nator]

Which CELL model it was ?, as far i saw in the photos posted by people that had this problem it seems to happen with the CELL models that have that spherical "bumps" (16 in total) located all along the border

Im not sure if is a coincidence, but the CELL models with that "bumps" are glued to the DIE (and is a glue btw, not soldered), in this photos it can be seen a bit, is a thermal glue of light gray color

Hi. This is my slim:
CECH 2504A date code 0C
Mobo JTP-001
Serial 1-882-481-21
CELL CXD2992GB
RSX CXD5300DGB

This thread is unclear and i'm not sure at this point whether to do a delid.
My temps are around 65/68° with games like dirt 3, motorstorm 1, midnight club, far cry2, rainbow six. The fan is set to CFW with the coolest option, i think 60°. Would you suggest me a delid?

.....starting with the 2500 Series, the CELL/BE Die is soldered into the IHS to avoid problems like deterioration on the CELL die, leading to overheating....

Where do you find this information?

Which CELL model it was ?, as far i saw in the photos posted by people that had this problem it seems to happen with the CELL models that have that spherical "bumps" (16 in total) located all along the border

Im not sure if is a coincidence, but the CELL models with that "bumps" are glued to the DIE (and is a glue btw, not soldered), in this photos it can be seen a bit, is a thermal glue of light gray color

What do you mean by "glued not soldered"
According to this video it's not even glued

 

[Kleon1876]

Is 3001 ket-001 delidable or it's soldered down?

 

[Fraizer]

I think it is that video who decided me to delid my 2501 :

Since his was a 2503 I thought I was good. I saw the black plate so just like he said, I was expecting the bumps. I took my time and very slowly cut through the glue, then pried a little bit until it popped-up, split in half... I'll have nightmares tonight

Here is the CELL I've destroyed miserably :

View attachment 25535

Hi what tool you use ? because NCS tool look not enough long to reach deep the silicon... like maybe you cut all what you can and pop it up like the RSX by forcing with another tool ? thank you ^^