Hi, yes sorry i mistyped it, i can't even restore the system, it YLODS in like 5 to 7 seconds i start it without HDD and it's the same thing.
PS3 Fault finding YLOD with the SYSCON - First steps and Error reporting
Timbo9876
Member
You need to test the co sole using the syscon fan profile. If you can get through the first two chapters in TLOU, your console is running well
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I see. Now Im more interested to test console to see if its truly working well. I will be updating this post when I finish 2 first chapters. I will check syscon fan profiles and try to modify it too.
Thank you.
--EDIT 2023-07-19--
Ehhh.. Wanted to change 3.3v battery because time and display settings would reset after being off. But worse problem popped out after replacing it. It timed when I clicked to set time via internet and thought software part got messed up because I was lazy to set manually and gave false hope. Trying to turn on afterwards would give RSX problems.
Code:
# CODE CLOCK
# A0801601 0B49E5D6
# A0801701 0B49E5D6
# A0403034 0B49E5A5
# A0404432 0B49E5A5
# A0801601 0B49E59E
# A0801701 0B49E59D
# A0403034 0B49E4F4
# A0404432 0B49E4F3
# A0801802 0B49E470
# A0403034 0B49E457
# A0404432 0B49E456
# A0403034 0B49E35B
# A0404432 0B49E35B
# A0801601 0B49E350
# A0801701 0B49E34F
Last edited:
Timbo9876
Member
This is why we test, there was always the possibility that the heat used to remove the tokins resulted in a false positive.
So yeah, it looks like a reball is required. I believe you said this was a "L" revision. Did it have a 65nm RSX?
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Yea, looks like PS3 fats need a really good thorough testing to eliminate problems like these. Reballing would be the ideal way for fixing this issue, but dont have equipment for that or willing to pay for reballing. But maybe I will still try to reflow or find a way to put more pressure to keep it working for some time, because Im interested in fan profiles and would like to play with it for a bit.
Yes, its a CECHL03, VER-001. According to wiki it is 65nm RSX.
Timbo9876
Member
You can try this, I found that by applying pressure with thermal pads on the CPU side, it resolved the flip chip or BGA issue.
See my YouTube link below
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Interesting. I would think, that putting thermal pads behind RSX would be better in this case. But reading description it looks like you have fixed many consoles using this method on CELL, sounds like pretty reliable way. At first I was tempted to test this method on RSX out of curiosity, but then I gave more thought to it and it might make it worse for CELL since its delided. Because CELL clamp point wont be so flat anymore, it will be at some angle due to RSX bump from modification and would risk of cracking die corners, I think. I got some 1mm thick 1x1cm pads. Thicker ones I could harvest from few PS3 spares that I have.
Thank you for sharing your knowledge and helping out.
I will be updating this post how it went using this modification on CELL.
--EDIT 2023-07-19--
Ehh.. Problems keep popping..
At first just tried to put 3x1mm small pads in the middle and then thicker one on top to see how it would go. But then console would instantly crash with A0093003 error. Sadly I didint tried to power on before doing anything today and I hope it is just a coincidence and CELL tokins just decided to retire. Or it has never ending issues..
Some other day I will be replacing CELL tokins.. Will give update after doing that
Last edited:
Timbo9876
Member
Interesting, it seems the pressure mod has worked, but you know, have an issue with the CPU capacitors
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I have read some posts online that suggest it's not as common as people think that the NEC Tokins are at fault. Posts have suggested that delidding the CPU and repasting might solve it.
What are people's thoughts on this?
Timbo9876
Member
From what you have said its more likely to be the tokins.
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Hey @vyktormvmpay25 as you have mention having a couple of superslims can you provide the values for these smd components around both of these chip this motherboard is a pqx can you use replacement from an msx board are there value difference'sDid not tested voltage so far I want to go further with 5 Super slims. All dead. One with some vertical strange lines on screen after swapped rsx still same issue on screen.
About 1.5 v on ram it has to normal to slims and super slim. Why? Because on ps4 all rams are out of gpu and all powered in parallel from a strong line with same 1.5v.
Ps4 designed very similar to ps3.
Edit
Testing Nxp001 motherboard superslim models
I think I may be out of faulty table?
Attachments
RIP-Felix
Senior Member
I wouldn't be suprised if your European L model has a DIA-001 motherboard, with a 90nm RSX. SONY screwed europe and M models have it, possably other phats too.
RIP-Felix
Senior Member
So, I'm going to try my best at being diplomatic and not mince words.
Pay attention to the step number of the error code. the 2 digits before the last four digit error code. Lower numbers occur sooner.
For example:
09 3003 (CPU VRM fower faiulure) occurs sooner than 40 3034 (FlexIO Bit Calibration).
When you have 40 3034, you most likely have a RSX BGA or Bump failure.
If you put uneven pressure on the CPU (not the problem) and then get 09 3003. you DID NOT fix the 3034. You may have broken the BGA on CPU VDDC and caused a separate issue that now occurs earlier.
You have turned 1 problem into 2. Damaged the console.
If you fix the CPU damage, you will still have the original issue to deal with.
Pay attention to the step number of the error code. the 2 digits before the last four digit error code. Lower numbers occur sooner.
For example:
09 3003 (CPU VRM fower faiulure) occurs sooner than 40 3034 (FlexIO Bit Calibration).
When you have 40 3034, you most likely have a RSX BGA or Bump failure.
If you put uneven pressure on the CPU (not the problem) and then get 09 3003. you DID NOT fix the 3034. You may have broken the BGA on CPU VDDC and caused a separate issue that now occurs earlier.
You have turned 1 problem into 2. Damaged the console.
If you fix the CPU damage, you will still have the original issue to deal with.
Timbo9876
Member
Wouldn't it be advisable to remove the pads to see if the error remains?
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RIP-Felix
Senior Member
The pressure situation might change and cause the broken BGA to reconnect physically (if it's that). The error might go away, but wont fix the damage that caused it. You're basically holding 2 wires together, litterally pressing a ball against a pad, or broken trace in just the right spot to get it to work... temporarily.
Ultimately, it's not repair. It's a red herring preying on your desire for an easy solution.
Do not add pressure underneath the main processors of any electronics device! A backplate is already built into the design of the PS3 and it provides the coplaner support the MB needs so as not to sag. The Cell bracer SONY used to fill the CPU hole is exactly 1mm thick, the same as the standoffs on the backplate. So it doesnt add pressure. It braces the MB and prevents it from bowing/sagging in the middle between the standoffs.
What the eraser mod and thermal pads do is add an upward force on the MB and CPU interposer, which undermines the design of the leaf spring/backplate system. They are designed to pull the heatsink into the die, while bracing the MB from behind, without bending the MB and placing strain on the BGA. What you're doing does (allow the MB to bow) and I've heard of multiple reports of this breaking the BGA and or cracking the die! Usually that's from the eraser mod because it's stiffer, thermal pads have more give and are safer, but it's still not safe. It's a gambit either way. One that's not necessary or advisable to take!
Especially since the CPU is fine. IBM designed it correctly and genuine CPU BGA defects present differently and are far more rare than GPU issues. So much rarer I'd replace the RSX with a 40nm RSX twice before even considering the Cell!
Leave the poor CPU out of this. It did nothing to you.
Ultimately, it's not repair. It's a red herring preying on your desire for an easy solution.
Do not add pressure underneath the main processors of any electronics device! A backplate is already built into the design of the PS3 and it provides the coplaner support the MB needs so as not to sag. The Cell bracer SONY used to fill the CPU hole is exactly 1mm thick, the same as the standoffs on the backplate. So it doesnt add pressure. It braces the MB and prevents it from bowing/sagging in the middle between the standoffs.
What the eraser mod and thermal pads do is add an upward force on the MB and CPU interposer, which undermines the design of the leaf spring/backplate system. They are designed to pull the heatsink into the die, while bracing the MB from behind, without bending the MB and placing strain on the BGA. What you're doing does (allow the MB to bow) and I've heard of multiple reports of this breaking the BGA and or cracking the die! Usually that's from the eraser mod because it's stiffer, thermal pads have more give and are safer, but it's still not safe. It's a gambit either way. One that's not necessary or advisable to take!
Especially since the CPU is fine. IBM designed it correctly and genuine CPU BGA defects present differently and are far more rare than GPU issues. So much rarer I'd replace the RSX with a 40nm RSX twice before even considering the Cell!
Leave the poor CPU out of this. It did nothing to you.
Snake_Plissken92
Member
Hi guys, i have a question. I have fat model CECHK04, and there is no video, only with AV scart i have video. I read somewhere that coulprit could be Silicon image chip on those models, since i couldn't find anything wrong with HDMI port. My question is: can syscon find errors with HDMI port or chip if i pull errorlog on usb from pkg syscon reader? Or will syscon even show those errors? Thank you in advance.
Timbo9876
Member
Hi Felix,
It's not a fix, and myself and another user came to this conclusion a while ago. I use thermal pads because they are, as you have mentioned, safer.
In this case, it's clear that the RSX is in trouble, I must admit I never thought a small amount of pressure using silicone thermal pads behind the CPU would damage the motherboard. I respect your knowledge and experience. From my personal experiences, I have never had a COK-002 motherboard fail due to pressure being added behind the CELL. In fact, it has helped cool the console down, and as we now know, it's extremely important to keep a 90mm RSX chip as cool as possible.
Not everyone will have either the money or experience to re-ball or perform a frankenstian mod. Although I agree that replacing the RSX is the best solution, it simply isn't a viable solution for everyone. In your case, you spent hours of your time obsessing over the cause, and i, along with the rest of the PS3 community, thank you for your expertise and dedication. But not everyone is going to go to these lengths, and it's important to have alternative methods. So, my pressure mod (a variation on Naked Snakes eraser mod) is for people who don't have the technical knowledge, time , or money to do the correct fix. Their console is dead, and they have nothing to lose by trying this. If it works, they can recover their saves and buy another PS3. This is obviously a far cheaper option than saving up over 300 pounds (UK currency) to have their console fixed, and even then its not guaranteed to last.
So, just for the record, adding pressure behind the CELL is a last resort, when the correct fix is simply not an option financially and learning to perform a re-ball or frankenstian mod is beyond the users capabilities.
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RIP-Felix
Senior Member
If it ain't broke, don't fix it. It may not break. I've had an A01 since 2013 that still runs reliably with it's 90nm RSX. And I have a launch model 360 (2005 xenon) that wont die either. Point is, there's no reason to fear what may never happen.
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