PS3 «Tutorial» PS3 CELL B/E Thermal Dissipation without removing the IHS

Hello everyone. Why does no one think about the thickness of the glue that is glued to the GPU cover, after removing the glue from the cover there is a gap, it needs to be filled.
If this place is not filled, the pressure will only be on the crystal, the memory plate will not touch.
I'm putting thin plates in now, it definitely hasn't gotten any worse.
 
Side Note: Sony corrected this design flaw, with the preceding models (CECH-30XX and 40XX), so the CELL B/E is soldered to the IHS...

Hi everyone.

I just cleaned&repasted PS3 slim 2xxx and I notice CPU/Cell temperature is still high. Well, it is bellow 70c, but with higher fan speeds. I have PS3 slim 3xxx probably never opened and while temperatures are still around bellow 70c, fan is much quitter. I guess this quote is reason for that? Correct me if I am wrong. I am talking about idle. With gaming 2xxx goes even worse with fan speeds (temperature still just bellow 70c, fan speed is automatic), and 3xxx is barely increasing the speeds, if all. RSX temperatures on both consoles are the same, compensate for fan speed, just above 50c after 10 minutes of idle.

I will try this fix with piece of rubber. I just wanted to check is this physical difference between 2xxx and 3xxx, because I planed to keep 2xxx for me and sell 3xxx, but now after I heard both of them, using HEN is not that big problem :D.
 
Ok. This rubber mod definitely works. Fan speeds are now significantly lower. Still thinks fan is little more "nervous" (speed goes up and down) compared to 3xxx and I yet have to clean and change paste on 3xxx.

Now is the question, should I keep 3xxx or 2xxx. What is your view on that?

Thank you.
 
Ok. This rubber mod definitely works. Fan speeds are now significantly lower. Still thinks fan is little more "nervous" (speed goes up and down) compared to 3xxx and I yet have to clean and change paste on 3xxx.

Now is the question, should I keep 3xxx or 2xxx. What is your view on that?

Thank you.
25xx is the best non BC model to own
 
Nahh i can't believe this was that easy. I litterally can't believe it.

My old FAT PS3 went from turning on then maximum speed fan 10 sec after and shutting down itself to a completely quiet PS3. This is ridiculous. There's no ways.

It's been 5 minutes now and the PS3 is fine, the fan is a little bit more higher but it's working. That's crazy. I just can't believe it.
 
New here, I already changed the thermal paste and I did the eraser mod and it has lowered the CPU temperatures from 77 to 63 in game but RSX remain at 70. ps3 slim 2501a, could I do the same with the RSX eraser mod?
 
Actually, if you think in that squared white piece of plastic located in between the metal clamps and the motherboard there are 2 problems with them

The biggest problem are that 4 "bumps" at the corners... it would be much better to remove the "bumps" to have a better contant surface VS surface (white plastic piece VS motherboard surface, both very flat)... this would spread the pressure perfectly

The second problem is that is made of plastic... so it has his own flexibility (we dont know how much though)... you know, the metal clamp is "pushing" the white squared piece at his center, but the plastic piece touches the motherboard in 4 points at the corners... so the pressure could create a curvature at his center

The "hole" at the back of CELL is making this problem even bigger
At the CELL edges you have the pressure transfered this way:
Metal clamp (line) ---> white plastic (4 dots at the edges) ---> motherboard ---> BGA ---> substrate ---> DIE ---> IHS ---> Heatsink

And at the CELL center (with the custom rubber mod) this way:
Metal clamp (line) ---> white plastic (center) ---> rubber ---> substrate ---> DIE ---> IHS ---> Heatsink

-------------
Is very hard to calculate the thickness/heights of the custom rubber mod suggested in this thread, but i think it can be made better

For CELL a piece of rubber with the same size than the white square + a solid piece of plastic to fill the hole at the back of CELL
And for RSX another piece of rubber with the same size than the white square, but without the solid plastic piece to fill the hole

This way the pieces made of rubber are working like springs, and are going to transfer the pressure to a perfect squared area

late for the (mod), So is it possible to put it on the rsx, what if the eraser touches an smd component close to the rsx? would it affect?
I already changed the thermal paste, should I do it again if I do the mod on the rsx
 
It is reddit. Full of clowns that pretend to be "expert" in everything. Their "reddit culture" is so toxic that they even doing this on other sites eg. FB groups or other forums.

Heck, when you have "out-of-the-box" idea that you want to convey, you will met with full of downvotes, criticism and even harassment while they stole your idea and credit themselves as theirs.
I have used thermal pads to create the modification. I have also used a variation of this mod to recover GLOD consoles (not a fix). Having had 7 out of 9 consoles recover, I was keen to share my findings with the PS3 community on this site. Since then, I have had some correspondence with some highly respected members who have highlighted that pressure behind the CELL processor is not a good idea.They has explained to me that this effectively can damage the motherboard and can cause a multitude of errors, including 3001 (which happened to a member that placed pressure behind the CELL)

So this mod is dangerous and can, at worst, damage your console so it won't boot. This would turn a working console into a faulty one. I feel it's important to stress the dangers of the potential damage to the hardware this mod could cause.

I also understand that de-lidding is a dangerous procedure to attempt. I can understand why someone may want to do this mod as it's far easier than lifting the CRLL IHS. If your console is running so hot and a de-lidd is not an option for you (maybe you can't afford it, maybe you feel the risk is too great) then its important to understand that this mod does come with its dangers also. From personal experience, if you wish to attempt this mod, I would recommend thermal pads to lower the risk of damage to your console. I personally have never had this mod fail using thermal pads, but then I probably haven't tried it on enough consoles to generate an accurate statistic.

So my thoughts are....

I feel it is important to give both the pros and cons. Don't get me wrong, this mod has its place in this community but shouldn't be used as an alternative to de-lidding, but instead as a last resort if de-lidding is not a option, and this also goes for my mod. It shouldn't be used as an alternative to a re-ball or Frankenstian, but it can be used if this is not an option and the user has nothing to lose by trying it.



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I created an account just to thank for this amazing tip.

My PS3 slim (cech-2104a) cpu went from 70°+ in the xmb (even after new thermal paste) to 50°. This just after 10 minutes in the xmb, this trick is worth a shot!
 
Since then, I have had some correspondence with some highly respected members who have highlighted that pressure behind the CELL processor is not a good idea.They has explained to me that this effectively can damage the motherboard and can cause a multitude of errors, including 3001 (which happened to a member that placed pressure behind the CELL)
How long did it take for it to be damaged or damaged instantly?
 
I took a pad that comes sticked on southbridge (thickness is 2-2.5mm),cut it to the size needed and put it under the cpu.Now temps are not going over 75°C under high load with 50% fan speed, before doing this fan was going crazy 2 minutes after I turn on the console and leave it on idle.I know 75°C is not perfect but this is without any fan control and before it was over 75°C with 100% fan speed.
 
I cut 3mm thic ruber muffin plate. It can stand up heat when backing muffins in the owen. Temps went down from 70c at 55% fan and new thermal paste in xmb and 70c at 80% fan when playing, to 51c cpu and rsx at 35% fan in xmb. Prety god mod, if no risk to cpu back presure. Not sure to try deliding, to risky for my.
 
some get a cracked electronics doing that ? i read report about something similar because it put pression on the processor not on the motherboard who result to damage

thank you :)
 
some get a cracked electronics doing that ? i read report about something similar because it put pression on the processor not on the motherboard who result to damage

thank you :)
i have cut up business cards about the size of the IHS directly under the cell and rsx for about 6-8 years now, still going strong, 35% fan speed is more than enough to keep it under 70 at all times even with a 25c room temperature (mind you this is in a 3k thats 45/40 nm )

EDIT: i seem to remember seeing a video saying that doing the eraser method thats putting a piece of an eraser on the hole directly under the cell where the capacitors are its a terrible idea because it can crack the die

but doing it the way i did it should be fine since the presure its spread over a bigger more even area it should be fine, as loong as whatever you put there isnt too thick/too hard
 
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hello Cosmic sorry for the late answer i get some personal issue in life ^^

do you have pelase an picture of where you put exactly your buisness card ? because im not used yet of the ps3 inside. i have a Slim version -2004A

if i delied and replace the thermal past do you think it have sense to put an visit card to increase the pression ?

thank you
 
hello Cosmic sorry for the late answer i get some personal issue in life ^^

do you have pelase an picture of where you put exactly your buisness card ? because im not used yet of the ps3 inside. i have a Slim version -2004A

if i delied and replace the thermal past do you think it have sense to put an visit card to increase the pression ?

thank you
if you delid (or pay someone else to do it for you) and the ps3 survives i personally see no point in doing this mod, this mod is what comes before delid in case you dont wanna risk it. not quite as good results as a delid but much less risk of killing the console

i am aware of the risks and the reasons some people have to not recommend this mod due to risk of cracking the die and they are valid and i agree with them but i choose paper in the first place because it gives in a little as opposed to a hard piece of plastic or a coin or the other stuff i saw while researching this.
but i personally do think that 6+ years of those things being in there and the ps3 to still work just fine makes a pretty strong argument that the mod could work if done correctly. i do remember being met with some backlash when i said what i had done and someone said paper wasnt a good idea because it could catch fire or something.
maybe my console is an outlier maybe am extremely lucky, who knows i only did it because when i disassembled the console for the first time (Still had warranty seal) i noticed the fan getting louder than it ever did so i did this and that was the fix for me, console has been completely disassembled since when it had the hdmi port replaced so the pressure has been released and reapplied. (same exact business card went back in) cant say for sure if theres a limit of how many times that extra pressure can be released an reaplied but for the time being it works

anyways forgive my rant heres where they go (sourced a pic from the internet, because last time it was completely disassembled was in late 2020 and i dont wanna replace the paste thats still good) if you or anyone else wants to try this cut up bussiness cards and make sure theyre about the size of the IHS NOT THE DIE and stack them up about 1mm maybe 1.5mm i cant remember since it was so long ago and put them where the yellow colored stuff is, be aware youre doing this on your own risk i am not responsible for whatever might or might not happen to your console just keep this in mind.
upload_2024-3-25_23-53-59.jpeg


am just sharing my own personal experience with it, havent seen anyone else online said theyve used stacked up business cards for added pressure so no-one can say for sure what the success rate is
 
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