Actually, if you think in that squared white piece of plastic located in between the metal clamps and the motherboard there are 2 problems with them
The biggest problem are that 4 "bumps" at the corners... it would be much better to remove the "bumps" to have a better contant surface VS surface (white plastic piece VS motherboard surface, both very flat)... this would spread the pressure perfectly
The second problem is that is made of plastic... so it has his own flexibility (we dont know how much though)... you know, the metal clamp is "pushing" the white squared piece at his center, but the plastic piece touches the motherboard in 4 points at the corners... so the pressure could create a curvature at his center
The "hole" at the back of CELL is making this problem even bigger
At the CELL edges you have the pressure transfered this way:
Metal clamp (line) ---> white plastic (4 dots at the edges) ---> motherboard ---> BGA ---> substrate ---> DIE ---> IHS ---> Heatsink
And at the CELL center (with the custom rubber mod) this way:
Metal clamp (line) ---> white plastic (center) ---> rubber ---> substrate ---> DIE ---> IHS ---> Heatsink
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Is very hard to calculate the thickness/heights of the custom rubber mod suggested in this thread, but i think it can be made better
For CELL a piece of rubber with the same size than the white square + a solid piece of plastic to fill the hole at the back of CELL
And for RSX another piece of rubber with the same size than the white square, but without the solid plastic piece to fill the hole
This way the pieces made of rubber are working like springs, and are going to transfer the pressure to a perfect squared area