But isn't the Cell BE prone to BGA cracking problems too, at least on first generation Phats (CECHA~E)? Also, isn't the Cell the main offender when it comes to the YLOD?
I never tried delliding the PS3 on purpose, but when I first opened my CECHE Fat the RSX IHS came out by itself together with the heatsink unit that was glued to it through the old thermal grease. Then I repasted both below and above the IHS and called it a day. It's true that it's really easier to delid the GPU.
I have a 1st Gen CECHC04 and the BGA didn't crack on me lol
Before that i also had a reballed C04 in 2011,which failed miserably.
The issue isn't with the Solder balls, but rather the chip itself, specifically the RSX its the one to blame.
Poor maintenance, dust and dry thermal paste are the cause, not to mention the poor fan syscon on OFWs, which prioritises noise over proper cooling, with time causing the RSX Core to overheat and fail.
Do this experiment. Get a heat gun, heat the RSX to 150° and you will see that it works.
If that doesn't work, heat the NEC capacitors, if they are bad, they only start if heated, all NEC based machines present this issue.
GPUs works on the same principle, and all use lead free solder BGA, same with the PS3, did you ever see a PS3 Slim failing? I didn't, not at least at YLOD, thats not because its running on a 40nm RSX instead of 90nm, and belive me, ive seen more Slims getting the RSX close to 65°C, with the same fan speed as a 1st Gen 90nm,but yet the Slims don't fail.
That's because the Solder balls aren't the issue, and YLOD its not a specific problem.
This its a silly myth that people created through home remedies back in the day, but people created they're own reballing bubble that they refuse to belive otherwise, and as long as it works, they will continue to do so.
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