PS3 Thermal paste question help

SR4NK4R

Member
I owned a lot of ps3's and i always spread a thin layer arctic silver 5 all over the IHS and a small dot but now im just making a dot because i dont like to over applying it. Which sometimes go on the board and i have to clean it all.

I dont see any difference in covering whole IHS and making a dot.
My 30xx temps the same both these methods.
Like 33% fan speed on XMB, CPU 43, RSX 47.
Even my 25xx did make no difference.

With room temp 20°.

So the question is: why would you spread the thermal paste all over the IHS?

Another question: are thermal pads on 25xx and below neccesary/needed?
Normally i threw them away but now i know i shouldnt do that.
 
It depends. Sometimes, having thermal compound all over the IHS surface will guarantee the most heat transfer surface to the heatsink, but the edges must make full contact (which doesn't happen, most of the time).

As long as you use a good thermal compound, and make enough (not too much) pressure between the IHS and the heatsink, you should be fine.

Regarding thermal pads, that's tricky. I've never got the chance to see all the thermal pads on my 2500 Slims, both either had them removed, missing, or misplaced. And I couldn't find any reference on the Internet about where to place them, which thickness, etc.

In the end, I've removed them completly because if you have one misplaced, you could end up separating the motherboard from the heatsink, and canceling the heat transfer in the process.
 
It depends. Sometimes, having thermal compound all over the IHS surface will guarantee the most heat transfer surface to the heatsink, but the edges must make full contact (which doesn't happen, most of the time).

As long as you use a good thermal compound, and make enough (not too much) pressure between the IHS and the heatsink, you should be fine.

Regarding thermal pads, that's tricky. I've never got the chance to see all the thermal pads on my 2500 Slims, both either had them removed, missing, or misplaced. And I couldn't find any reference on the Internet about where to place them, which thickness, etc.

In the end, I've removed them completly because if you have one misplaced, you could end up separating the motherboard from the heatsink, and canceling the heat transfer in the process.
Thanks for the answer. I also had two 25xx, one died with RSX failure i think. It had artifacts and would freeze after seconds of turning on. It also didnt have thermal pads. I dont think the thermal pads are the reason for this. Maybe ChatGPT knows the exact thermal pad tickness? I did ask where they were located: VRMs, memory chips? Around the Cell and RSX.

This is his answer:
For the PS3 Slim 25xx models, the typical thickness of the thermal pads used on components like the VRMs (Voltage Regulator Modules) and other smaller chips is usually around 1mm to 1.5mm.
When replacing thermal pads, it's important to match the original thickness to ensure proper contact and heat transfer between the components and the heatsink or chassis. If the thermal pads are too thick, they may prevent proper fitting of the heatsink, while pads that are too thin won't provide adequate heat dissipation.
If you're unsure, 1mm thermal pads are generally a safe choice, but inspecting the original pads during disassembly can help confirm the correct thickness.

ChatGPT said 30xx and 4xxx models do not have thermal pads. But i found one inside my 30xx?
 
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YibAFG0.jpg
Are you looking for this thermal pad?Model is 25XX,I provided pictures and I took measurements they are 2mm thick, for the thermal paste application method I myself use a 9 point style and then bend the pressure plate slightly and they will cover pretty well, I would not recommend covering the IHS completely as the pressure of the pressure plate is not enough to flatten it completely.
 

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